2009 PC outlook slashed on credit crunch
Single-digit PC unit shipment growth of only 4.3% is expected next year as IT equipment purchases take a back seat to "real issues," like paying staff or making rising mortgage payments, according to iSuppli.
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NXP targets medical market with wireless communication partnership
Medical electronics is one of the fastest growing areas of semiconductor development and is becoming increasingly important for NXP, according to the company's CTO.
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Elpida uses immersion litho for 50-nm process DDR3 SDRAM
The 50-nm process DDR3 SDRAM was developed using 193-nm immersion lithography technology and copper interconnect technology and has a chip size of less than 40-mm-squared.
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Memory Test Platform Handles Multiple Device Types
Verigy’s newest memory test family handles flash, DRAM and multichip packages (MCPs) — at the price of a flash tester.
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Premier Farnell target dangers of unregulated e-waste recycling in developing countries
The electronics supply chain company will lead investment and lobbying initiatives to reduce the health and environmental impact of electronic-waste recycling.
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Lam cuts 600 jobs, capital equipment industry takes another hit
Following on the heels of Applied Materials' and KLA-Tencor's layoffs, wafer fabrication equipment provider Lam Research says it will trim 15% of its total workforce.
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IBM seeks to simulate brain
IBM researchers and university partners aim to build low-power-consumption and compact-sized computing systems that they expect will simulate and emulate the brain’s abilities for sensation, perception, action, interaction, and cognition. Initial research will focus on demonstrating nanoscale, low-power synapse-like devices, with the long-term mission to demonstrate low-power, compact cognitive computers that approach mammalian-scale intelligence.
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ST joins MIT, ultra-low-power MCU devices group
ST will work with MIT's Microsystems Industrial Group on ultra-low-power electronics, sensor systems, and medical electronics.
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Shinoda Plasma Creates Flexible Plasma Display
At the FPD International show in Yokohama, Japan, Shinoda Plasma Co. Ltd. demonstrated a large-format flexible plasma display panel measuring 1 × 3 m. The plasma display has a thickness of only 1 mm, and is designed for large-scale digital signage used at public venues such as museums and subways.
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AMD lays off 500
The move follows a 1,650 employee reduction announced in April that saw approximately 10% of the MPU maker's staff let go and is part of AMD's larger effort to reduce its breakeven to $1.5 billion a quarter.
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IBM cuts 100 contract workers
The cuts impact supplemental employees that are used as a flexible workforce in manufacturing, working for periods ranging from one to three years.
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Cadence cuts 625 jobs as it looks to save $150 million
Following the abrupt exit of former CEO Mike Fister and the postponement of its Q3 report, Cadence announces a 12% layoff and says it will also cut a "substantial number" of contractors and consultants in an effort to save $150 million.
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Apple's iPhone production could fall 40%, hurt chip suppliers' Q4s, analysts say
FBR Research supply chain checks find that Apple's iPhone production plans are being revised lower, which suggests the macroecomomic weakness is impacting even high-end consumers and that "no market segment will be spared in this global downturn." Chip suppliers, including Broadcom and Marvell, will feel a Q4 pinch on the production cuts, the firm says.
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Financial crisis will cost semiconductor market more than $25 billion in 2009, Gartner reports
According to the market research company's preliminary estimates, the economic crisis will force worldwide semiconductor revenue growth in 2009 to be only 1%, down by almost 7% from previous estimates. "In a recession, it is important to remember that there will not only be a potential reduction in the number of systems sold, but also a move to lower-cost systems with less semiconductor content," says Bryan Lewis, research VP at Gartner.
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Freescale, Motorola lay off on bleak cellular businesses
Amid efforts to sell or spin off their respective cellular handset chipset businesses, both companies plan job cuts and launch 2009 cost-savings efforts.
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NAND faces historic downturn in 2008, 2009, iSuppli reports
iSuppli expects decreasing unit growth in the NAND flash market potentially will impact the semiconductor capital equipment industry.
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IMEC Calls for True European Collaboration
To increase Europe’s microelectronics competitiveness, nanoelectronics research center IMEC (Leuven, Belgium) is asking Europe and its governing public authorities to stimulate true cross-border collaborations, not only by setting up networks but also by creating financial means.
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SIA charts semi slowdown: September sales up 1.6% year-over-year
Year-to-date sales growth of 4% trails mid-year forecast of 4.5%; sinking memory prices drag down total.
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Intel gains microprocessor market share, AMD flips, as PC shipments show healthy growth in Q3, iSuppli reports
The increasingly competitive environment resulting from the global financial crisis hinders smaller players' MPU market share growth, iSuppli says. The research company also reports that while there were signs of weakening PC demand in the quarter, early estimates indicate that shipments actually showed healthy growth. Both iSuppli and IDC point out the notebook markets' retained strength and momentum.
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TI Blitzes to Improve Fab Productivity
Texas Instruments Inc. has used rapid improvement events, or kaizen blitzes, to sharply improve productivity at the DFAB in Dallas. TI also incorporated a “5S” program to “get the junk out,” fab manager Steve James said in a keynote speech at the ISMI Symposium on Manufacturing Effectiveness. Other speakers at the annual symposium detailed the importance of preventive maintenance techniques.
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Advantest-headed test group could challenge or complement STC
With similar goals to those of the Semiconductor Test Consortium, Advantest, Intel, LTX-Credence, and others team to form the "Collaborative Alliance for Semiconductor Test" and state their intent to formalize the organization within one of the existing associations serving the industry in the very near term.
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Broadcom seals AMD DTV deal for $50 million less than anticipated
Broadcom pays $141.5 million for AMD's digital TV business, more than $50 million less than the original purchase price on anticipated low Q4 revenue from the business.
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Numonyx plans 65-nm flash rollout for 2009
Numonyx extends its support of the M29 memory industry standard, announcing a new family of security enhanced, high-density memory products that represent the first of its product lines planned to be deliver on 65-nm technology through the course of 2009.
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Oerlikon Sells Optics Business at Balzers
Oerlikon OC said it agreed to sell its optical coatings business located at Balzers, Liechtenstein, to a management buyout group. Oerlikon said it is also in divestiture discussions regarding its optics business units located in Golden, Colo., and Shanghai, China.
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AMD promotes Rivet, allowing Meyer opportunity to focus on engineering
AMD has promoted Bob Rivet from CFO to chief operations and administrative officer in a move that could allow CEO Dirk Meyer to focus more on technology design at the MPU maker. Also Emilio Ghilardi, senior VP and general manager of sales for EMEA, will assume the role of chief sales officer at the beginning of 2009.
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MagnaChip ends imaging work in effort to save $50 million
In making the exit, the company said it incurred impairment charges of $26.3 million in its Q3 and expects to record approximately $15.2 million in restructuring charges in Q4.
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NXP snags National Semi exec for global sales slot
Mike Noonen fills an open position at NXP left vacant by Pascal Langlois' move to ST-NXP Wireless.
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Samsung withdraws $5.85 billion bid for SanDisk, but analyst suggests interest remains
A poor Q3, planned layoffs, and a hurried capacity deal with rival Toshiba encourage Samsung to withdraw its $26 per share bid for flash maker SanDisk. One analyst suggests the matter may not be put to rest, however, and that Samsung may come back with a lower bid as SanDisk's stock continues to plummet.
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SanDisk sells Toshiba joint venture capacity, saves $1 billion
SanDisk will sell Toshiba 30% of the current manufacturing capacity from the two companies' joint ventures, Flash Partners and Flash Alliance, giving it a cash infusion and reducing its equipment lease obligations by approximately $1 billion. Despite widely acknowledged falling memory prices, Toshiba welcomes the capacity and estimates that the NAND flash memory market will grow in the medium to long term with average annual bit growth rate of more than 200%.
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Conexant sells wireless IP for $15 million
The sale follows on a November 2007 statement from Conexant, announcing that it was discontinuing further investments in standalone wireless networking product development. However, the company retains the right to incorporate the wireless IP in any current and future products.
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AMD Q3 financials improve, but losses still a concern
Although financials are improving at AMD and the MPU maker's GPU revenue increased by 55% in the September quarter, analysts continue to expect losses in coming quarters. Looking to Q4 and noting the macroeconomic environment, CEO Dirk Meyer says he does not expect the quarter to have its usual strength, but "it does not seem like a disaster."
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NTT DoCoMo, Renesas, Fujitsu, Sharp develop HSUPA mobile phone platform
NTT DoCoMo, Renesas Technology, Fujitsu, and Sharp plan to jointly develop their next SH-Mobile G series single-chip LSI device, and a platform incorporating it, to support the HSUPA/HSDPA/W-CDMA and GSM/GPRS/EDGE mobile telephony standards. The announcement is further evidence of mobile industry partnering trends that include both chipmakers and handset makers.
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Unisem Takes Copper Wirebonding Process to Volume Production
Unisem plans to set up 30% of its wirebonders for copper by 2009. The industry’s interest in copper wirebonding is being driven largely by copper’s enhanced performance characteristics.
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US tech jobs increase, but growth slowing
The US high-tech industry added 78,300 jobs between January and July of 2008, a 1.3% rise compared to the same period in 2007 and below the private sector's 2% growth. The most significant growth occurred in engineering and tech services, which added 50,000 jobs, a 3.1% rise, according to data from the AeA.
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Mobility boosts Intel Q3, Wall Street sighs with relief
CEO Paul Otellini says the "Atom family is off to a very good start" as Intel's mobility group chips in more than 45% of the MPU leader's total $10.2 billion Q3 revenue. Although Intel has reduced its capital forecast for the year, the company cautions that it is not reducing ramp rate on 45 nm and is not pushing out 32-nm work.
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IBM extends China research
Noting the "pool of science and engineering talent" in the region, IBM opens its first new research facility in 10 years in Shanghai as an extension of the existing IBM China Research Laboratory.
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IMEC Method Extends Lifetime of Organic Solar Cells
IMEC and its associated laboratory Institute for Materials Research in MicroElectronics reported they have improved the composition of organic solar cells. Researchers developed conjugated polymers to stabilize the nanomorphology of the active layer.
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TechSearch: Steady Growth Ahead for Flip-Chips, WLP
Flip-chips and wafer-level packaging (WLP) are emerging as industry “bright spots,” with a continued growth rate of 14% forecasted for both flip-chips and WLP between 2007 and 2012, according to a study by TechSearch International Inc.
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Samsung enters US notebook, netbook market
As PC sales in the United States continue to defy economic trends, Samsung comes to the market with five notebooks and one netbook that it believes will allow it access to the business and consumer segments.
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Vishay gives up on proposed IR acquisition
The announcement comes after Vishay's three nominations to IR's board were voted down and concludes a months-long running drama between the two companies that started when IR received an unsolicited $1.6 billion acquisition bid from Vishay.
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Avnet to buy IP&E distributor Abacus in $73 million deal
Avnet plans to acquire UK-based distributor Abacus Group as it continues to expand its global reach and IP&E (interconnect, passive and electromechanical) portfolio.
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Qimonda slashes 3,000 jobs, exits 200-mm production, CFO resigns
Jobs will be cut as the struggling DRAM maker attempts to reposition itself by selling off investments and exiting 200-mm manufacturing, ramping down manufacturing in Virginia and in Germany.
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Micron pays $400 million for Qimonda's Inotera stake, shuffles MeiYa resources
Micron will buy Qimonda's stake in its Nanya DRAM joint venture Inotera Memories. In conjunction with the acquisition, Micron and Nanya plan to cease future resource commitments to MeiYa Technology, a DRAM venture the two companies established in the spring, and redirect those resources to Inotera.
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Semi equipment demand not expected to recover until 2010, Gartner reports
As the global economic slowdown continues to have a significant impact on the semiconductor industry, capital spending is still slowing across the board, with all segments seeing a decline in capital spending in 2008 and through 2009, according to market researchers at Gartner Dataquest.
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NXP puts 200-mm fab up for sale
Philips spin-out NXP Semiconductors said Tuesday that it has retained ATREG, the semiconductor sales division of Colliers International, to sell its 200-mm semiconductor fab located in Fishkill, NY, for an undisclosed price.
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Renesas, Panasonic to develop 32-nm SoCs
Continuing their joint process technology development that has been happening since 1998, Tokyo-based electronics giant Panasonic Corp and semiconductor company Renesas Technology Corp reported today that they are collaborating to develop the elemental process technologies for 32-nm SoCs and are confident that this technology can be applied to products that are in mass production.
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